Low Inductance Capacitor Designs

The inductance associated with getting electric charge into and out of a capacitor is generally much more important than the value of the capacitor at high frequencies. The best high frequency capacitor designs generally employ a package that minimizes the connection inductance for a given application. This project reviewed trends in VLSI packaging and developed low-inductance capacitors optimized for future applications.

Patents:

T. Hubing, H. Kwak and H. Ke, “Capacitive-Stemmed Capacitor,” U.S. Patent Application 61/143581, Jan. 9, 2009.

B.-H. Lee, M.-C. Park, H.-C. Kwak, H. Ke and T. Hubing, “Semiconductor Integrated Circuit Chip, Multilayer Chip Capacitor and Semiconductor Integrated Circuit Chip Package,” U.S. Patent Application, Docket No. 069576-0440, Nov. 13, 2008 /(Korean Patent No.->P10-2009-0055615, Jun. 22, 2009, Korea).