Technical Papers Published in 2004

Development and Application of a Fast Multipole Method in a Hybrid FEM/MoM Field Solver
C. Guo and T. Hubing
Journal of the Applied Computational Electromagnetics Society
vol. 19, no. 3, Nov. 2004, pp. 126-134.

Expert System Algorithms for Identifying Radiated Emission Problems in Printed Circuit Boards
H. Shim, T. Hubing, T. Van Doren, R. DuBroff, J. Drewniak, D. Pommerenke, R. Kaires
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 57-62.

Analysis of Chip-Level EMI using Near-Field Magnetic Scanning
X. Dong, S. Deng, T. Hubing, D. Beetner
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 174-177.

Via Coupling within Power-Return Plane Structures Considering the Radiation Loss
R. Chen, J. Chen, T. Hubing, W. Shi
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 386-391.

Radiated Emissions from Populated Printed Circuit Boards Due to Power Bus Noise
H. Shim, Y. Fu, T. Hubing
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 396-400.

A Preliminary Study of Maximum System-Level Crosstalk at High Frequencies for Coupled Transmission Lines
X. Dong, H. Weng, D. Beetner, T. Hubing, R. Wiese, J. McCallum
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 419-425.

Investigation of Cavity Resonances in an Automobile
H. Weng, D. Beetner, T. Hubing, X. Dong, R. Wiese, J. McCallum
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 766-770.

Effects of Open Stubs Associated with Plated Through-Hole Vias in Backpanel Designs
S. Deng, J. Mao, T. Hubing, J. Drewniak, J. Fan, J. Knighten, N. Smith, R. Alexander, C. Wang
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 1017-1022.

Radiation Mechanisms for Semiconductor Devices and Packages
T. Hubing, D. Beetner, S. Deng and X. Dong
Proc. of the EMC'04 Sendai Symposium
Sendai, Japan, June 2004.